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CYANTEK
CORPORATION |
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Chemicals
for microlithography, developers, etches, strippers, cleaners, e-beam
chemicals, Nanostrip™, Lodyne™, solvents, emulsion chemicals,
custom blending, and custom packaging for the Semiconductor and related
industries
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GENERAL PRODUCT LIST
I. POSITIVE
PHOTORESIST DEVELOPERS
| CC-191S |
1.91% TMAH + surfactant |
| CC-214S |
2.14% TMAH + surfactant |
| CC-238S |
2.38% TMAH + surfactant |
| CC-300 |
Various Concentrations
Various % TMAH |
| CC-300.40 |
1.89% TMAH |
| CC-564 |
1.33% TMAH + surfactant |
| CC-200 |
Various Concentrations KOH |
| CC-726 |
KOH + H3BO3
Buffered |
| CC-727 |
1:4 Working Solution of
CC-726 |
| CC-850 |
K2CO3 |
II.
E-BEAM RESIST DEVELOPERS
| DP-12 |
MIAK 100% |
| DP-13 |
MIAK 80% + MPK 20% |
| DP-14 |
MIAK 70% + MPK 30% |
| DP-50 |
DEM 50% + DEK 50% |
| DP-60 |
BLO 79% + Butyl Lactate 21% |
III. E-BEAM DEVELOPER RINSE
| RP-10 |
MIAK + IPA |
| RP-21 |
MIBK |
IV. PRE-ETCH SOLUTIONS
| PEH-1 |
For use with Perchloric Acid
Cr Etchants |
| PEH-3 |
For use with Perchloric Acid
Cr Etchants |
| PEA-1 |
For use with Acetic Acid Cr
Etchants |
| PEN-1 |
For use with Nitric Acid Cr
Etchants |
V. CHROMIUM ETCHANTS
| CR-3, 5, 7, 9, 41
& Others |
Perchloric Acid
Base |
{
|
Available with surfactant denoted as "S" or
"S10" |
10 – 30 A/sec
Etch Rate |
| CR-14 & Others
|
Acetic Acid
|
18
A/sec |
| CR-4 & Others |
Nitric Acid |
22
A/sec |
| CR-100 |
Selective in presence of Cu |
1 – 2
A/sec |
VI.
ALUMINUM ETCHANTS
| AL-12S & Others |
Phosphoric + Acetic + Nitric
+ surfactant |
VII. BUFFERED OXIDE ETCHANTS
| Lodyne BOE 6:1, 15:1 |
Hydrofluoric + Ammonium
Fluoride + surfactant |
| & Other blends |
|
VIII.
NICKEL ETCHANTS
| NI-2 |
Sulfuric + Peroxide |
| NI-3 |
Nitric + Peroxide |
| CR-4 |
CAN + Nitric |
IX. COPPER ETCHANTS
| CU-5 |
Sulfuric- + Peroxide |
| PA-50 |
Phosphoric + Acetic +
Peroxide |
| CR-4 |
CAN + Nitric |
X. SILICON DIOXIDE/POLYSILICON
ETCHANTS
| SI-2 |
Ammonium Fluoride + Nitrate |
| MME-235 |
Nitric + Hydrofluoric |
XI. INDIUM TIN OXIDE ETCHANTS
| LCE-10 |
Hydrochloric + Nitric |
| LCE-12 |
Hydrochloric + Ferric
Chloride + Nitric |
XII. IRON OXIDE ETCHANTS
| FE12-CC11 & 13 |
Hydrochloric + Ferrous
Chloride |
XIII. PHOTORESIST STRIPPERS
| Nano-Strip & 2X |
Sulfuric + Peroxide |
All Positive and
Negative Resists |
| RS-6 |
TMAH Based Stripper |
Positive Novalac
Photoresists |
| RS-7S |
KOH Based Stripper + G/E |
" |
| RS-41 |
NaOH Based Stripper + G/E |
" |
| RSC-50 |
Solvent |
" |
| RS-100 |
" |
{ |
Positive Optical
+ E-Beam Resists |
| RS-111 |
" |
| RS-112 |
" |
| RS-120 |
" |
| RS-122 |
" |
| NRS-305 |
" |
Negative
Polyisoprene Photoresists |
XIV.
CLEANING SOLUTIONS
| CA-31 |
NH4OH
+ Surfactant |
| CA-40
|
NaOH + Surfactant |
| MC-171C |
(Concentrate) NH4OH
+ Surfactant |
| MC-100 |
(Concentrate)
Detergent |
| RA-2 |
Alkaline
Detergent Rinse |
| SSC-1 |
Acidic Detergent
Rinse |
| Nano-Strip & 2X |
Sulfuric +
Peroxide |
XV. EMULSION PROCESS
CHEMICALS
| PD-86 & PD-8650 |
Negative Developer |
| PF-95 |
Fixer |
| D-8 |
Reversal Developer |
| CB-15, CB-16 or CB-16C |
Clearing Bath |
| RB-90 or RB-90C |
Reversal Bleach |
More
>>
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